pb lead-free parts square with 4leads type led lamps ligitek electronics co.,ltd. property of ligitek only data sheet L20UY9653R-50D-AM doc. no : qw0905-L20UY9653R-50D-AM rev. : a date : 16 - sep. - 2008
100% 100% 75%50% -60 25% 25% 0 50%75% -30 directivity radiation 0 30 60 ligitek electronics co.,ltd. property of ligitek only note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. part no. L20UY9653R-50D-AM package dimensions page 1/5 1.55 5.08 0.3 0.4 2.5 0.5 3.5 0.5 5.08 0.3 0.5 4.4 0.5 anode cathode ? 1.9 7.6 1.2c ? 4.6 7.6 3.4
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. dominant wave length dnm typical electrical & optical characteristics (ta=25 ) algainp material L20UY9653R-50D-AM part no yellow water clear color emittedlens luminous intensity @50ma(mcd) viewing angle 2 1/2 (deg) forward voltage @50ma(v) spectral halfwidth nm 20 590 typ. max. 30 770014000 typ. min. esd electrostatic discharge( * ) operating temperature storage temperature t opr tstg forward current peak forward current duty 1/10@10khz reverse current @5v power dissipation ir pd i fp i f v 2000 -40 ~ +85 -40 ~ +100 10 220 90 70 a mw ma ma absolute maximum ratings at ta=25 parameter symbol page 2/5 ratings uy(r) unit ligitek electronics co.,ltd. property of ligitek only static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * 2.13.5 part no. L20UY9653R-50D-AM
typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 20uy(r) chip 3/5 page part no. L20UY9653R-50D-AM 400 300 02.5 1.5 0.5 650 600 550 0.5 0.0 500 wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a 1.0 1.0 0.6 0.4 0.2 0.0 0.8 6080 02040 -40 0.96 0.94 3.0 2.0 1.02 1.00 0.98 1000 500 0 200 100 0 1.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.2 relative intensity vs. forward current forward current(ma) f o r w a r d c u r r e n t ( m a ) fig.1 forward current vs. forward voltage forward voltage(v) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 ambient temperature( ) fig.4 relative intensity vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature 0 5.0 10 15 25 20 100 -20 1.2 1.4 -20 100 -40 40 20 080 60 1.04
page 4/5 ligitek electronics co.,ltd. property of ligitek only dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 120 note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max 25 0 0 2 /sec max preheat 50 100 260 temp( c) 260 c3sec max 5 /sec max time(sec) 150 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile part no. L20UY9653R-50D-AM
reference standard description page 5/5 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 test condition test item reliability test: 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) operating life test low temperature storage test high temperature storage test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles high temperature high humidity test thermal shock test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. ligitek electronics co.,ltd. property of ligitek only mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to see soldering well performed or not. solder resistance test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 5 2.dwell time= 10 1sec. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 part no. L20UY9653R-50D-AM
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